Solder Joint Reliability Assessment

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Beschreibung

This book offers a systematic approach to assessing reliability of solder joints using Finite Element simulation, including problems in solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, mechanisms of joint fatigue and more.

This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.

Presents a systematic approach in performing reliability assessment

Emphazises accurate quantitative assessment through basic understanding of the mechanics of materials

The presented simulation methodology is readily applicable to numerous problems

Includes supplementary material: sn.pub/extras



Inhalt
Introduction.- Overview of the Simulation Methodology.- Requirements for Finite Element Simulation.- Mechanics of Solder Materials.- Application I: Solder Joint Reflow Process.- Application II: Solder Joints under Temperature and Mechanical Cycles.- Damage Mechanics-based Models.- Application III: Board-level Drop Test with BGA Package.- Fatigue Fracture Process of Solder Joints.- Closure.

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Produktinformationen

Titel
Solder Joint Reliability Assessment
Untertitel
Finite Element Simulation Methodology
Autor
EAN
9783319343013
ISBN
3319343017
Format
Kartonierter Einband
Herausgeber
Springer International Publishing
Anzahl Seiten
188
Gewicht
295g
Größe
H235mm x B155mm x T10mm
Jahr
2016
Untertitel
Englisch
Auflage
Softcover reprint of the original 1st ed. 2014
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